0

CHOOSE YOUR COUNTRY OR REGION.

Close
  • Integrated Circuits (ICs)
  • RF/IF and RFID
  • Optoelectronics
  • Sensors, Transducers
  • Switches

14,978,973 Products, 1,105 Categories   View All Integrated Circuits (ICs) Products >

Quality

We thoroughly investigate supplier credit qualification to control the quality from the beginning. We have our own QC team, which can monitor and control the quality during the whole process, including in-coming, storage, and delivery. Our QC Department will pass all parts before shipment. We offer a 1-year warranty for all parts we offer.

Our testing includes:


    Visual Inspection
    Functions Testing
    X-Ray
    Solderability Testing
    Decapsulation for Die Verification

Visual Inspection

Use of stereoscopic microscope, the appearance of components for 360 ° all-round observation. The focus of observation status includes product packaging, chip type, date, batch, printing, packaging state, pin arrangement, coplanar with the case plating, and so on.
Visual inspection can quickly understand the requirement to meet the external requirements of the original brand manufacturers, anti-static and moisture standards, and whether used or refurbished.

Functions Testing

All functions and parameters tested, referred to as a full-function test, according to the original specifications, application notes, or client application site, the full functionality of the devices tested, including DC parameters of the test, but does not include AC parameter feature analysis and verification part of the non-bulk test the limits of parameters.

X-Ray

X-ray inspection, the traversal of the components within the 360 ° all-round observation, to determine the internal structure of components under test and package connection status, you can see a large number of samples under test are the same, or a mixture (Mixed-Up ) the problems arise; in addition, they have with the specifications (Datasheet) each other than to understand the correctness of the sample under test. Connection status of the test package, to learn about the chip and package connectivity between pins is customary, to exclude the key and open-wire short-circuited.

Solderability Testing

This is not a counterfeit detection method as oxidation occurs naturally; however, it is a significant issue for functionality and is particularly prevalent in hot, humid climates such as Southeast Asia and the southern states of North America. The joint standard J-STD-002 defines the test methods and accept/reject criteria for thru-hole, surface mount, and BGA devices. The dip-and-look is employed for non-BGA surface mount devices, and the “ceramic plate test” for BGA devices has recently been incorporated into our suite of services. Devices delivered in inappropriate, acceptable packaging but are over one year old or display contamination on the pins are recommended for solderability testing.

Decapsulation for Die Verification

A destructive test that removes the insulation material of the component to reveal the die. The die is then analyzed for markings and architecture to determine the traceability and authenticity of the device. A magnification power of up to 1,000x is necessary to identify die markings and surface anomalies.